深圳市力之锋电子设备有限公司
SMT整套方案设备领导者
SMT整套方案设备领导者
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Imaging Method
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Dynamic Imaging with true 3D profile measurement
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Top Camera
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4 Mpix
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Angle Camera
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N/A
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Imaging Resolution
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10 µm, 15 µm (factory setting)
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Lighting
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Multi-phase RGB+W LED
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3D Technology
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Single/Dual 3D laser sensors
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Max. 3D Range
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20 mm
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Imaging Speed
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4 Mpix@ 10 µm 2D: 60 cm²/sec
4 Mpix@ 15 µm 2D: 120 cm²/sec 4 Mpix@ 10 µm 2D+3D: 27-39 cm²/sec* 4 Mpix@ 15 µm 2D+3D: 40-60 cm²/sec* * Depending on board size and laser resolution |
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X-Axis Control
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Ballscrew + AC-servo controller
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Y-Axis Control
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Ballscrew + AC-servo controller
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Z-Axis Control
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N/A
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X-Y Axis Resolution
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1 µm
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WxDxH
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TR7700 SIII 3D: 1100 x 1670 x 1550 mm
Note: not including signal tower, signal tower height 520 mm |
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Weight
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TR7700 SIII 3D: 1030 kg
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Max PCB Size
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TR7700 SIII 3D: 510 x 460 mm
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PCB Thickness
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0.6-5 mm
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Max PCB Weight
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3 kg
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Top Clearance
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25 mm
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Bottom Clearance
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40 mm
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Edge Clearance
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3 mm [5 mm optional]
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Conveyor
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Inline
Height: 880 – 920 mm * SMEMA Compatible |
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Component
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Missing
Tombstoning Billboarding Polarity Rotation Shift Wrong Marking (OCV) Defective Upside Down Extra Component Foreign Material Lifted Component |
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Solder
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Excess Solder
Insufficient Solder Bridging Through-hole Pins Lifted Lead Golden Finger Scratch/Contamination |
